Technical ability

Technical ability
Products advantages
  • 01 Equipped with 4-port 67GHz PNA and self-developed probe platform, it can realize passive S-parameter test at PCB board level
  • 02 It is equipped with a variety of high-speed connectors to realize passive S-parameter test of the Coupon board of high-speed project
  • 03 Equipped with multiple TDR high-speed differential probes to ensure PCB level TDR testing and problem analysis
Simulation process for high - speed ATE test board
High-speed design scheme customization
Socket/PCB cascade optimization
PCB hole simulation analysis
Full link performance simulation analysis
Full link performance test
Simulation process targets high-power rate ATE test board
Power design scheme formulation
IR Drop simulation optimization
AC impedance simulation analysis
Full link ripple simulation analysis
Full link performance test
Comparison of simulation and measured data for PCB board
Comparison of simulation and measured data for H112 PAM4 Ultra High Speed Project (120Gbps)

回波损耗在DC-40GHz以内满足规格要求; 插入损耗在目标频率30GHz处,仿真与实 测差异约0.6db。

Comparison of simulation and measured data for PCB power

Lingang test board assemblies mass production line

In December 2021, the construction of SMT high-precision super-size research and development line was completed. It has a whole line of international advanced automatic mounting equipment and testing equipment, and is capable of mounting precision devices such as 01005, 0201 and BGA Pitch 0.20mm, which can undertake welding and assembly of various high-precision ATE load plates.
SMT process capabilityChip area index
PCB Size (Max)650*610mmComponent size (Max)0.15*0.3mm
PCB thickness (Max)10mmChip size (Max)100*100mm
PCB weight (Max)10kg
Chip spacing (Max)0.20mm

SMT process capabilitySMT process capability

Repetition accuracy              

Temperature uniformity in the warm zone


Repetition accuracy    

Repetition accuracy 

Minimum PAD

Oxygen content control


Angle 0.1°Angle 0.1°

PAD minimum interval

BGA minimum spacing
Minimum spacing

The temperature uniformity in the warm zone is


MLC/MLO process capabilityEquipment welding capability
MLC/MLO size(Max)160*160mmWelding position accuracy<25μm
MLC/MLO dimension weight500gFlatness of welding<65μm
MLC/MLO dimension spacing (Min)0.25mmDelivery cycle3 days

3D SPI3D AOI2.5D X-RayFlying probe test

Repetition accuracy

Repetition accuracy
Detect repeatability


Detect repeatability
Open-circuit test current

Detect repeatability
Component size (Max)Insulation resistance

Open-circuit resistance